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LEON-G100/G200 - System Integration Manual

GSM.G1-HW-09002-C Preliminary Handling and soldering

Page 67 of 75

3.2.5 Repeated reflow soldering

Only a single reflow soldering process is encouraged for boards with a LEON-G100/G200 module populated on

it. The reason for this is the risk of the module falling off due to high weight in relation to the adhesive

properties of the solder.

3.2.6 Wave soldering

Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices

require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for

boards populated with LEON-G100/G200 modules.

3.2.7 Hand soldering

Hand soldering is not recommended.

3.2.8 Rework

The LEON-G100/G200 module can be unsoldered from the baseboard using a hot air gun.

Avoid overheating the module.

After the module is removed, clean the pads before placing.

Never attempt a rework on the module itself, e.g. replacing individual components. Such

actions immediately terminate the warranty.

3.2.9 Conformal coating

Certain applications employ a conformal coating of the PCB using HumiSeal

or other related coating products.

These materials affect the HF properties of the LEON-G100/G200 modules and it is important to prevent them

from flowing into the module.

The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore

care is required in applying the coating.

Conformal Coating of the module will void the warranty.

3.2.10 Casting

If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such

processes in combination with the LEON-G100/G200 module before implementing this in the production.

Casting will void the warranty.

3.2.11 Grounding metal covers

Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the

EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide

optimum immunity to interferences and noise.

u-blox makes no warranty for damages to the LEON-G100/G200 module caused by soldering metal cables

or any other forms of metal strips directly onto the EMI covers.

3.2.12 Use of ultrasonic processes

Some components on the LEON-G100/G200 module are sensitive to Ultrasonic Waves. Use of any Ultrasonic

Processes (cleaning, welding etc.) may cause damage to the module.

u-blox offers no warranty against damages to the LEON-G100/G200 module caused by any Ultrasonic

Processes.

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MaxTech NXP-16 Spezifikationen Seite 67