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LEON-G100/G200 - System Integration Manual

GSM.G1-HW-09002-C Preliminary Design-In

Page 58 of 75

2.2.2 Footprint and paste mask

29.5 mm [1161 mil]

1.0 mm [39. mil]

18.9 mm [744 mil]

1.55 mm [61 mil]

1.1 mm [43 mil]

0.8 mm [31.5 mil]

0.8mm

[31.5 mil]

Figure 36: LEON-G100/G200 footprint

Stencil: 200 m

17.6 mm [693 mil]

18.9 mm [744 mil]

22.7 mm [893.5 mil]

0.8 mm

[31.5 mil]

0.6 mm

[23.5 mil]

Figure 37: LEON-G100/G200 paste mask

To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the

volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)

extending beyond the Copper mask. The solder paste should have a total thickness of 200 m.

The paste mask outline needs to be considered when defining the minimal distance to the next component.

The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific

production processes (e.g. soldering etc.) of the customer.

The bottom layer of LEON-G100/G200 shows some unprotected copper areas for GND and VCC signals, plus

GND keep-out for internal RF signals routing.

Consider “No-routing” areas for the LEON-G100/G200 footprint as follows:

1. Ground copper and signals keep-out below LEON-G100/G200 on Application Motherboard due to VCC

area, RF ANT pin and exposed GND pad on module bottom layer (see Figure 38);

2. Signals Keep-Out below module on Application Motherboard due to GND opening on LEON-G100/G200

bottom layer for internal RF signals (see Figure 39).

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MaxTech NXP-16 Spezifikationen Seite 58