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LEON-G100/G200 - System Integration Manual

GSM.G1-HW-09002-C Preliminary System description

Page 41 of 75

1.10 SIM interface

An SIM card interface is provided on the board-to-board pins of the module: the high-speed SIM/ME interface is

implemented as well as automatic detection of the required SIM supporting voltage.

Both 1.8 V and 3 V SIM types are supported: activation and deactivation with automatic voltage switch from 1.8

to 3 V is implemented, according to ISO-IEC 78-16-e specifications. The SIM driver supports the PPS (Protocol

and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM

Card.

Table 7 describes the board to board pins related to the SIM interface:

Name

Description

Remarks

VSIM

SIM supply

1.80 V typical or 2.85 V typical automatically generated by the

module

SIM_CLK

SIM clock

3.25 MHz clock frequency

SIM_IO

SIM data

SIM_RST

SIM reset

Table 7: SIM Interface pins

Figure 25 shows the circuit with the minimal connections between the LEON module and the SIM card.

Figure 25: SIM interface application circuit

When connecting the module to SIM connector perform the following steps on the application board:

To prevent RF coupling: ground via a 47 pF capacitor (e.g. Murata GRM1555C1H470J) near the SIM

connector on each SIM signal (SIM_CLK, SIM_IO, SIM_RST)

Ground via a 100 nF capacitor (e.g. Murata GRM155R71C104K) on the SIM supply (VSIM).

Mount very low capacitance ESD protection (e.g. Infineon ESD8V0L2B-03L or AVX USB0002RP) near the

SIM card connector

Limit capacitance on each SIM signal to match the SIM specifications: the connections should always be

routed as short as possible

LEON-G100/G200

35VSIM

SIM_IO

SIM_CLK

SIM_RST

LEON-G100/G200

35VSIM

SIM_IO

SIM_CLK

SIM_RST

1 2 ... 36 37 38 39 40 41 42 43 44 45 46 ... 74 75

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