MaxTech NXP-16 Spezifikationen PDF herunterladen (Seite 59)

LEON-G100/G200 - System Integration Manual

GSM.G1-HW-09002-C Preliminary Design-In

Page 59 of 75

Figure 38: Ground copper and signal keep-out below data module on application motherboard due to due to VCC area, RF ANT

pin and exposed GND pad on data module bottom layer

Figure 39: Signals keep-out below data module on application motherboard due to GND opening on data module bottom layer

for internal RF signals

Routing below LEON-G100/G200 on application motherboard is generally possible but not recommended: in

addition to the required keep-out defined before, consider that the insulation offered by the solder mask

painting may be weakened corresponding to micro-vias on LEON-G100/G200 bottom layer, thus increasing the

risk of short to GND if the application motherboard has unprotected signal routing on same coordinates.

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MaxTech NXP-16 Spezifikationen Seite 59